China’s Chip Packaging Boom: Homegrown Firms Race Ahead of Global Rivals

Chinese chipmakers are accelerating their push into high‑end advanced packaging, a move that could reshape the global semiconductor landscape. Tongfu Microelectronics has begun mass‑producing flip‑chip packages with high yields and has filed an AI‑focused packaging project in Nantong, positioning itself for the lucrative AI accelerator market. The company also announced a breakthrough in co‑packaged optics (CPO), with early reliability tests passed and further development tied to customer demand. At the same time, Huatai Technology is leveraging its integration expertise to break into the premium new‑energy‑vehicle sector, while new partnerships with AI firms open fresh growth avenues. The surge in large‑model AI and the rollout of smart cars are driving stricter requirements for chip performance, power efficiency and integration density, making 2.5D/3D, fan‑out and CPO packaging essential. Domestically, leaders like JCET have built a full‑stack packaging portfolio—covering wafer‑level, SiP, flip‑chip and wire‑bonding—to serve AI, automotive, HPC and networking applications. Their CPO solution merges optical engines with compute ASICs, slashing bandwidth bottlenecks and boosting energy efficiency. Internationally, ASE remains a frontrunner in fan‑out panel‑level packaging, planning AI‑GPU production on 600 × 600 mm panels by 2026, while giants such as Marvell and MediaTek consider Intel’s EMIB technology. These advances not only fuel the growth of Chinese chip firms but also reduce reliance on foreign packaging tech, pushing China’s semiconductor chain toward the high‑end tier and reshaping the competitive dynamics of the global market.

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China Unveils Ground‑Breaking ‘Future Network’ That Could Power 5G‑A, 6G and Beyond

A Chinese research team has announced a historic leap in communications technology, delivering the nation’s first major science‑and‑technology achievement in the information and communications field. Led by Liu Yunjie, the team pioneered a service‑customized network architecture and built the world’s first distributed, large‑scale network operating system. They also created a wide‑area deterministic network and a global data‑computing‑network scheduling platform, while cracking key photo‑electric integration technologies that are vital for the country’s “East Computing, West Computing” projects. The centerpiece of this effort is the Future Network Test Facility, an open‑access laboratory where universities, research institutes and companies can trial next‑generation technologies. The facility already supports the rollout of 5G‑A and is laying the groundwork for 6G, and it will eventually help shape a nationwide computing‑power network. During its construction, the team helped draft 206 national and international standards, secured leadership in IP standards, and earned 221 invention patents and 139 software copyrights. Their work has been honored with multiple national scientific awards. As Wu Hequan, an academician of the Chinese Academy of Engineering, put it, the test facility is a vital platform for turning cutting‑edge research into real‑world industry breakthroughs.

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